TPCP8501

Features: • High DC current gain : hFE = 100 to 300 (IC = 0.3 A)• Low collector-emitter saturation : VCE (sat) = 0.2 V (max)• High-speed switching : tf = 100 ns (typ.)PinoutSpecifications Characteristics Symbol Rating Unit Collector-base voltage VCBO 180 ...

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SeekIC No. : 004526224 Detail

TPCP8501: Features: • High DC current gain : hFE = 100 to 300 (IC = 0.3 A)• Low collector-emitter saturation : VCE (sat) = 0.2 V (max)• High-speed switching : tf = 100 ns (typ.)PinoutSpecifi...

floor Price/Ceiling Price

Part Number:
TPCP8501
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• High DC current gain : hFE = 100 to 300 (IC = 0.3 A)
• Low collector-emitter saturation : VCE (sat) = 0.2 V (max)
• High-speed switching : tf = 100 ns (typ.)



Pinout

  Connection Diagram


Specifications

Characteristics
Symbol
Rating
Unit
Collector-base voltage
VCBO
180
V
Collector-emitter voltage
VCEX
150
V
VCEO
100
Emitter-base voltage
VEBO
7
V
Collector current DC(Note1)
IC
2.0
A
Pulse (Note1)
ICP
4.0
EBase current
IB
0.2
A
Collector power dissipation(t = 10s) (t = 10s)
PC (Note2)
3.3
W
DC
1.3
Junction temperature
Tj
150
Storage temperature
Tstg
−55 to 150
Note 1: Please use devices on condition that the junction temperature is below 150.
Note 2: Mounted on FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and
             the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
             even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
             maximum ratings.

             Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
             ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test
             report and estimated failure rate, etc).




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