TPCP8302

Features: • Lead (Pb)-free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS(ON) = 25 m (typ.)• High forward transfer admittance: |Yfs| = 14 S (typ.)• Low leakage current: IDSS = −10 A (max) (VDS = −20 V)• Enhancemen...

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TPCP8302 Picture
SeekIC No. : 004526221 Detail

TPCP8302: Features: • Lead (Pb)-free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS(ON) = 25 m (typ.)• High forward transfer admittance: |Yfs| = 14...

floor Price/Ceiling Price

Part Number:
TPCP8302
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Lead (Pb)-free
• Small footprint due to small and thin package
• Low drain-source ON-resistance: RDS(ON) = 25 m (typ.)
• High forward transfer admittance: |Yfs| = 14 S (typ.)
• Low leakage current: IDSS = −10 A (max) (VDS = −20 V)
• Enhancement model: Vth = −0.4 to −1.0V (VDS = −6 V, ID = −1 mA)



Pinout

  Connection Diagram


Specifications

Characteristic Symbol Value Units
Drain-source voltage VDSS −20 V
Drain-gate voltage (RGS = 20 k) VDGR −20 V
Gate-source voltage VGSS ±12 V
Continuous Drain Current DC (Note 1) ID -5 A
Pulse (Note 1) IDP -20
Drain power
dissipation
t = 5 s) (Note 2a)
Single-device operation
(Note 3a)
PD(1) 1.48 W
Single-device value at
dual operation (Note 3b)
PD(2) 1.23

Drain power
dissipation
t = 5 s) (Note 2b)

Single-device operation
(Note 3a)
PD(1) 0.58
Single-device operation
(Note 3a)
PD(2) 0.36
Single-pulse avalanche energy (Note 4) EAS 6.5 mJ
Avalanche current IAR -5 A
Repetitive avalanche energy
Single-device value at dual operation
(Note 2a, 3b, 5)
EAR 0.12 mJ
Channel temperature Tch 150
Junction and Storage Temperature Range TJ, TSTG - 55 to +150


Note: For Notes 1 to 6, see the next page.

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling  recautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

This transistor is an electrostatic-sensitive device. Handle with care.




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