Features: • Lead (Pb)-free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS(ON) = 25 m (typ.)• High forward transfer admittance: |Yfs| = 14 S (typ.)• Low leakage current: IDSS = −10 A (max) (VDS = −20 V)• Enhancemen...
TPCP8301: Features: • Lead (Pb)-free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS(ON) = 25 m (typ.)• High forward transfer admittance: |Yfs| = 14...
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Features: • Small footprint due to a small and thin package• High speed switching̶...
Characteristic | Symbol | Rating | Unit | |
Drain-source voltage | VDSS | −20 | V | |
Drain-gate voltage (RGS = 20 k) | VDGR | −20 | V | |
Gate-source voltage | VGSS | ±12 | V | |
Drain current | DC (Note 1) | ID | −5 | A |
Pulse (Note 1) | IDP | −20 | A | |
Drain powerdissipation (t = 5 s) (Note 2a) |
Single-device operation Drain power (Note 3a) |
PD (1) | 1.48 | W |
Single-device value at dual operation (Note 3b) |
PD (2) | 1.23 | ||
Drain powerdissipation (t = 5 s) (Note 2b) |
Single-device operation(Note 3a) | PD (1) | 0.58 | |
Single-device value at dual operation (Note 3b) |
PD (2) | 0.36 | ||
Single-pulse avalanche energy (Note 4) | EAS | 6.5 | mJ | |
Avalanche current | IAR | −5 | A | |
Repetitive avalanche energy Single-device value at dual operation (Note 2a, 3b, 5) |
EAR | 0.12 | mJ | |
Channel temperature | Tch | 150 | ||
Storage temperature range | Tstg | −55 to 150 |