Application• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 13.5 m (typ.)• High forward transfer admittance: |Yfs| = 24 S (typ.)• Low leakage current: IDSS = -10 A (max) (VDS = -20 V)• Enhancement model: Vth = -0.45 to -1.2 V...
TPCP8102: Application• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 13.5 m (typ.)• High forward transfer admittance: |Yfs| = 24 S (typ.)• L...
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Features: • Small footprint due to a small and thin package• High speed switching̶...
Symbol | Characteristic | Rating | Unit | |
VDSS | Drain-Source Voltage | -20 | V | |
VDGR | Drain?gate voltage (RGS = 20 k) | -20 | V | |
VGSS | Gate?source voltage | ±12 |
V | |
ID IDP |
Drain current | DC (Note 1) | -7.2 | A |
Pulse (Note 1) | -28.8 | |||
PD | Drain power dissipation (T=25) (Note 2a) |
1.64 | W | |
PD | Drain power dissipation (t = 5 s) (Note 2b) |
0.84 | W | |
EAS | Single-pulse avalanche energy (Note 3) |
33.7 | mJ | |
IAR | Avalanche current | -7.2 | A | |
EAR | Repetitive avalanche energy (Note 4) | 0.168 | mJ | |
Tch | Channel temperature | 150 | ||
Tstg | Storage temperature range | -55~150 |
Note: For Notes 1 to 5, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.