Features: • Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 24 m (typ.)• High forward transfer admittance: |Yfs| = 14 S (typ.)• Low leakage current: IDSS = -10 A (max) (VDS = -20 V)• Enhancement model: Vth = -0.5 to -1.2 V (VD...
TPCP8101: Features: • Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 24 m (typ.)• High forward transfer admittance: |Yfs| = 14 S (typ.)• Low ...
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Features: • Small footprint due to a small and thin package• High speed switching̶...
Parameter |
Symbol |
Rating |
Unit | |
Drain-Source Voltage |
VDSS |
-20 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
-20 |
V | |
Gate-Source Voltage |
VGSS |
±8 |
V | |
Drain Current | DC (Note 1) |
ID |
-5.6 |
A |
Pulse (Note 1) |
IDP |
-22.4 | ||
Drain power dissipation (t = 5 s) (Note 2a) |
PD |
1.68 |
W | |
Drain power dissipation (t = 5 s) (Note 2b) |
PD |
0.84 |
W | |
Single-pulse avalanche energy (Note 3) |
EAS |
20.3 |
mJ | |
Avalanche current |
IAR |
-5.6 |
A | |
Repetitive avalanche energy (Note 4) |
EAR |
0.168 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
TJ, TSTG |
-55~150 |
Note: For Notes 1 to 5, refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and
the significant change in temperature, etc.) may cause this product to decrease in the reliability
significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within
the absolute maximum ratings. Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods)
and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.