Features: • Small footprint due to a small and thin package• High speed switching• Small gate charge: QSW = 7.5 nC (typ.)• Low drain-source ON-resistance: RDS (ON) = 130 m (typ.)• High forward transfer admittance: |Yfs| = 5.4 S (typ.)• Low leakage current: IDSS ...
TPCP8003-H: Features: • Small footprint due to a small and thin package• High speed switching• Small gate charge: QSW = 7.5 nC (typ.)• Low drain-source ON-resistance: RDS (ON) = 130 m (t...
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Features: • Small footprint due to a small and thin package• High speed switching̶...
Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDSS |
100 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
100 |
V | |
Gate-source voltage |
VGSS |
±20 |
V | |
Drain current | DC (Note 1) |
ID |
2.2 |
A |
Pulsed (Note 1) |
IDP |
8.8 |
A | |
Drain power dissipation (t = 5 s) (Note 2a) |
PD |
1.68 |
W | |
Drain power dissipation (t = 5 s) (Note 2b) |
PD |
0.84 |
W | |
Single-pulse avalanche energy (Note 3) |
EAS |
3.93 |
mJ | |
Avalanche current |
IAR |
2.2 |
A | |
Repetitive avalanche energy (Tc=25) (Note 4) |
EAR |
0.016 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
−55 to 150 |
Note: For Notes 1 to 4, refer to the next page.Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.