Features: · One pin digital volume control (for each channel)· Volume setting with up/down pulses· Auto repeat function on volume setting· Headphone sensing· Maximum gain set by selection pin· Low sensitivity for EMC radiation· Internal feedback resistors· Flexibility in use· Few external componen...
TDA8552TS: Features: · One pin digital volume control (for each channel)· Volume setting with up/down pulses· Auto repeat function on volume setting· Headphone sensing· Maximum gain set by selection pin· Low s...
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VDD |
supply voltage |
operating |
-0.3 |
+5.5 |
V |
Vi |
input voltage |
-0.3 |
VDD + 0.3 |
V | |
IORM |
repetitive peak output current |
- |
1 |
A | |
Tstg |
storage temperature |
-55 |
+150 |
||
Tamb |
operating temperature |
-40 |
+85 |
||
Vsc |
AC and DC short-circuit safe voltage |
- |
5.5 |
V | |
Ptot |
maximum power dissipation |
SO20 |
- |
2.2 |
W |
SSOP20 |
- |
1.2 |
W |
The TDA8552TS is a two channel audio power amplifier that provides an output power of 2 ´ 1.4 into an 8 load using a 5 V power supply. The TDA8552TS contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller.
Using the selection pin (GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption.
The TDA8552TS is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section "Thermal design considerations". The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout.