Application·HIGH CURRENT, HIGH SPEED SWITCHING·SWITCH MODE POWER SUPPLIES (SMPS)·DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)Specifications Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 200 V VDGR Drain- gate Voltage (RGS =...
STY60NA20: Application·HIGH CURRENT, HIGH SPEED SWITCHING·SWITCH MODE POWER SUPPLIES (SMPS)·DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)Specifications Symbol Parameter ...
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Symbol | Parameter | Value | Unit |
VDS |
Drain-source Voltage (VGS = 0) |
200 | V |
VDGR |
Drain- gate Voltage (RGS = 20 k) |
200 | V |
VGS |
Gate-source Voltage |
±30 | V |
ID |
Drain Current (continuous) at Tc = 25 |
60 | A |
ID |
Drain Current (continuous) at Tc = 100 |
40 | A |
IDM(•) |
Drain Current (pulsed) |
240 | A |
PTOT |
Total Dissipation at Tc = 25 |
300 | W |
Derating Factor |
2.4 | W/ | |
Tstg |
Storage Temperature |
-65 to 150 | |
Tj |
Max. Operating Junction Temperature |
150 |
The Max247TM package STY60NA20 is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.