Features: • 12A, 350V and 400V• rDS(ON) = 0.380W• Related Literature- TB334 Guidelines for Soldering Surface MounComponents to PC Boards Specifications RFH12N35 RFH12N40 UNITS Drain to Source Voltage (Note 1) VDSS 350 400 V Drain to Gate Voltage (RGS = 1MW) (No...
RFH12N40: Features: • 12A, 350V and 400V• rDS(ON) = 0.380W• Related Literature- TB334 Guidelines for Soldering Surface MounComponents to PC Boards Specifications RFH12N35 RFH12N40 ...
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RFH12N35 | RFH12N40 | UNITS | |
Drain to Source Voltage (Note 1) VDSS | 350 | 400 | V |
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 350 | 400 | V |
Continuous Drain Curren ID | 12 | 12 | A |
Pulsed Drain Current (Note 3) IDM | 24 | 24 | V |
Maximum Power Dissipation PD | ±20 | ±20 | V |
Maximum Power Dissipation | 150 | 150 | W |
Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | o C |
Linear Derating Factor | 1.2 | 1.2 | W/ oC |
Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | o C |
Package Body for 10s, See Techbrief 334 (for TO-218AC) Tpkg | 260 | 260 | o C |
These are N-Channel enhancement mode silicon gate power field effect transistors RFH12N40 designed for applications such as switching regulators, switching converters, motor drivers, relay drivers and drivers for high-power bipolar switching transistors requiring high speed and low gate drive power. These types RFH12N40 can be operated directly from integrated circuits.
Formerly developmental type TA17434.