Features: • 12A, 60V• rDS(ON) = 0.135W• Electrostatic Discharge Protected• UIS Rating Curve (Single Pulse)• Design Optimized for 5V Gate Drive• Related Literature- TB334 Guidelines for Soldering Surface MountComponents to PC Boards Specifications RFD...
RFD12N06RLESM: Features: • 12A, 60V• rDS(ON) = 0.135W• Electrostatic Discharge Protected• UIS Rating Curve (Single Pulse)• Design Optimized for 5V Gate Drive• Related Literature...
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RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE |
UNITS | |
Drain to Source Voltage (Note 1) VDSS |
60 |
V |
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR |
60 |
V |
Continuous (Figure 2)ID |
16 |
A |
Pulsed Drain Current (Note 3)IDM |
26 |
A |
Gate to Source Voltage VGS |
-5 to10 |
V |
Power DissipationPD |
40 |
W |
Linear Derating Factor |
0.32 |
W/oC |
Derate above 25oC |
0.20 |
W/oC |
Single Pulse Avalanche Energy RatingEAS |
Refer to UIS SOA Curve |
|
Operating and Storage Temperature .TJ, TSTG |
-55 to 75 |
o C |
Maximum Temperature for Soldering | ||
Leads at 0.063in (1.6mm) from Case for 10s TL |
300 |
o C |
Package Body for 10s, See Techbrief 334 Tpkg |
260 |
o C |