Features: · Surface Mount· Advanced Process Technology· Dynamic dv/dt Rating· Fast Switching· Fully Avalanche Rated· Lead-FreeSpecifications Parameter Max. Units ID @ TA = 25 Continuous Drain Current, VGS @ 10V** 2.3 A ID @ TA = 25 Continuous Drain Current, VGS @ 10V* 1.6 ...
PD - 95316: Features: · Surface Mount· Advanced Process Technology· Dynamic dv/dt Rating· Fast Switching· Fully Avalanche Rated· Lead-FreeSpecifications Parameter Max. Units ID @ TA = 25 Continuo...
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Features: · Repetitive Avalanche Ratings· Dynamic dv/dt Rating· Hermetically Sealed·Simple Drive R...
Features: · Single Event Effect (SEE) Hardened· Low RDS(on)· Low Total Gate Charge· Proton Toleran...
Features: · Single Event Effect (SEE) Hardened· Low RDS(on)· Low Total Gate Charge·Proton Tolerant...
Parameter | Max. | Units | |
ID @ TA = 25 | Continuous Drain Current, VGS @ 10V** | 2.3 | A |
ID @ TA = 25 | Continuous Drain Current, VGS @ 10V* | 1.6 | |
ID @ TA = 70 | Continuous Drain Current, VGS @ 10V* | 1.3 | |
IDM | Pulsed Drain Current | 6.4 | |
PD @TA = 25 | Power Dissipation (PCB Mount)** | 2.1 | W |
PD @TA = 25 | Power Dissipation (PCB Mount)* | 1.0 | W |
Linear Derating Factor (PCB Mount)* | 8.3 | mW/ | |
VGS | Gate-to-Source Voltage | ± 20 | V |
EAS | Single Pulse Avalanche Energy | 54 | mJ |
IAR | Avalanche Current | 1.6 | A |
EAR | Repetitive Avalanche Energy* | 0.1 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 |
Fifth Generation HEXFETs from International Rectifier PD - 95316 utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs PD - 95316 are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SOT-223 package of PD - 95316 is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pickand-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. PD - 95316 Power dissipation of 1.0W is possible in a typical surface mount application.