MXD1013

V_CC to GND...............................................................-0.5V to +6V
All Other Pins...............................................-0.5V to (V_CC + 0.5V)
Short-Circuit Output Current (1sec) ....................................50mA
Continuous Power Dissipation (T_A = +70)
8-Pin Plastic DIP (derate 9.1mW/ above +70) ............727mW
14-Pin Plastic DIP (derate 10.0mW/ above +70) ........800mW
8-Pin SO (derate 5.9mW/ above +70).........................471mW
16-Pin Narrow SO (derate 8.7mW/ above +70) ..........696mW
8-Pin MAX (derate 4.1mW/ above +70) ....................330mW
Operating Temperature Range ..............................-40 to +85
Storage Temperature Range ...............................-65 to +160
Lead Temperature (soldering, 10sec) ...............................+300
esses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

The MXD1013 contains three independent, monolithic, logic-buffered delay lines with delays ranging from 10ns to 200ns. Nominal accuracy is ±2ns for a 10ns to 60ns delay, ±3% for a 70ns to 100ns delay, and ±5% for a 150ns to 200ns delay. Relative to hybrid solutions, these devices offer enhanced performance and higher reliability, and reduce overall cost. Each output can drive up to ten standard 74LS loads.

The MXD1013 is available in multiple versions, each offering a different combination of delay times. It comes in the space-saving 8-pin MAX package, as well as a standard 8-pin SO and DIP. It is also offered in industry- standard 16-pin SO and 14-pin DIP packaging, allowing full compatibility with the DS1013 and other delay-line products.