MXD1000

V_CC to GND................................................................-0.5V to +6V
All Other Pins...............................................-0.5V to (V_CC + 0.5V)
Short-Circuit Output Current (1sec) ....................................50mA
Continuous Power Dissipation (T_A = +70)
8-Pin Plastic DIP (derate 9.1mW/ above +70) ............727mW
14-Pin Plastic DIP (derate 10.0mW/ above +70) ........800mW
8-Pin SO (derate 5.9mW/ above +70).........................471mW
16-Pin Narrow SO (derate 8.7mW/ above +70) ..........696mW
8-Pin MAX (derate 4.1mW/ above +70) ....................330mW
Operating Temperature Range ..............................-40 to +85
Storage Temperature Range ...............................-65 to +160
Lead Temperature (soldering, 10sec) ...............................+300
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional peration of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to bsolute maximum rating conditions for extended periods may affect device reliability.

The MXD1000 silicon delay line offers five equally spaced taps with delays ranging from 4ns to 500ns and a nominal accuracy of ±2ns or ±5%, whichever is greater. Relative to hybrid solutions, this device offers enhanced performance and higher reliability, and reduces overall cost. Each tap can drive up to ten 74LS loads.

The MXD1000 is available in multiple versions, each offering a different combination of delay times. It comes in the space-saving 8-pin MAX package, as well as an 8-pin SO or DIP, allowing full compatibility with the DS1000 and other delay line products.