Features: ` Designed for applications with stringent profile restrictions` Passivated mesa structure for very low leakage currents` Epitaxial structure minimizes forward voltage drop` Hermetically sealed, extremely low profile ceramic seal package with flexible copper leads for surface mount solde...
MX040-20: Features: ` Designed for applications with stringent profile restrictions` Passivated mesa structure for very low leakage currents` Epitaxial structure minimizes forward voltage drop` Hermetically s...
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` Designed for applications with stringent profile restrictions
` Passivated mesa structure for very low leakage currents
` Epitaxial structure minimizes forward voltage drop
` Hermetically sealed, extremely low profile ceramic seal package with flexible copper leads for surface mount soldering or welding
` Very low package inductance and thermal resistance
` Qualification estimated completion August 1998, includes temperature cycling 2,000 cycles at -197 to +150 (liquid-to-liquid)
` Available in reverse voltage ranges from 50V to 300V
DESCRIPTION | SYMBOL | MAX. | UNIT |
Peak Repetitive Reverse Voltage | VRRM | 200 | Volts |
Working Peak Reverse Voltage | VRWM | 200 | Volts |
DC Blocking Voltage | VR | 200 | Volts |
Average Rectified Forward Current, Tc 125°C | IF(ave) | 10 | Amps |
Nonrepetitive Peak Surge Current, tp= 8.3 ms, half-sinewave | IFSM |
100 | Amps |
Junction Temperature Range | Tj | -65 to +175 | |
Storage Temperature Range | Tstg | -65 to +175 | |
Thermal Resistance, Junction to Case: | JC | 1.0 (typ.0.4) |
/W |