Features: • Avalanche Energy Specified• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode• Diode is Characterized for Use in Bridge Circuits• IDSS and VDS(on) Specified at Elevated TemperatureSpecifications Rating Symbol Value Un...
MTP7N20E: Features: • Avalanche Energy Specified• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode• Diode is Characterized for Use in Bridge Circuits• IDS...
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Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• SPICE Parameters Available...
Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• SPICE Parameters Available...
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
200 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
200 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 20 ± 40 |
Vdc Vpk |
Drain Current - Continuous - Continuous @ @TC=100°C - Single Pulse (tp 10 s) |
ID ID IDM |
7.0 3.8 21 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
50 0.4 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 175 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =80Vdc,VGS = 10Vdc, Vdc,Peak IL =7.0Apk, L = 10mH, RG = 25) |
EAS |
74 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
2.5° 62.5° |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |