Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• SPICE Parameters Available• Diode is Characterized for Use in Bridge Circuits• IDSS and VDS(on) Specified at Elevated Temperature• Avalanche Energy SpecifiedSpecifications Rating Symbol Value Uni...
MTP75N03HDL: Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• SPICE Parameters Available• Diode is Characterized for Use in Bridge Circuits• IDSS and VDS(on) Specified at Elevated...
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Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• SPICE Parameters Available...
Features: • Ultra Low RDS(on), HighCell Density, HDTMOS• Diode is Characterized for Us...
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
25 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
25 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 15 ± 20 |
Vdc Vpk |
Drain Current - Continuous - Continuous @ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
75 59 225 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
150 1.0 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 175 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =25Vdc,VGS = 5.0Vdc, Vdc,Peak IL =75Apk, L = 0.1mH, RG = 25) |
EAS |
1250 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient ,when mounted with the minimum recommended pad size |
RJC RJA |
1.0 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |