Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low Profile (<1.1 mm) for thin applications such as PCMCIA cards• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life• Logic Level Gate Drive - Can Be Driven by Logic ICs&...
MTDF1N02HD: Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low Profile (<1.1 mm) for thin applications such as PCMCIA cards• Ultra Low RDS(on) Provides Hi...
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Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low ...
Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low ...
Features: • Miniature Micro8 Surface Mount Package - Saves Board Space• Extremely Low ...
Rating |
Symbol |
Typical |
Max |
Unit | |
DraintoSource Voltage |
VDSS |
- |
20 |
V | |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
- |
20 |
V | |
GatetoSource Voltage - Continuous |
VGS |
- |
± 8.0 |
V | |
1 inch SQ. FR4 or G10 PCB Figure 1 below 1 die operating Steady State |
Thermal Resistance - Junction to Ambient Total Power Dissipation @ TA = 25°C Linear Derating Factor Drain Current - Continuous @ TA = 25°C Continuous @ TA = 70°C Pulsed Drain Current (1) |
RTHJA PD ID ID IDM |
80 - - - - - |
100 1.25 10 2.8 2.3 23 |
°C/W Watts mW/°C A A A |
Minimum FR4 or G10 PCB Figure 2 below 1 die operating Steady State |
Thermal Resistance - Junction to Ambient Total Power Dissipation @ TA = 25°C Linear Derating Factor Drain Current - Continuous @ TA = 25°C Continuous @ TA = 70°C Pulsed Drain Current (1) |
RTHJA PD ID ID IDM |
160 - - - - - |
200 0.63 5.0 1.7 1.6 16 |
°C/W Watts mW/°C A A A |
Minimum FR4 or G10 PCB Figure 2 below 2 die operating Steady State |
Thermal Resistance - Junction to Ambient Total Power Dissipation @ TA = 25°C Linear Derating Factor Drain Current - Continuous @ TA = 25°C Continuous @ TA = 70°C Pulsed Drain Current (1) |
RTHJA PD ID ID IDM |
240 - - - - - |
300 |
°C/W Watts mW/°C A A A |
Operating and Storage Temperature Range |
TJ, Tstg |
- |
55 to 150 |
°C |