Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof· Hermetically sealed, surface mount power package· Low package inductance· Very low thermal resistance· Reverse polarity available upon request: MSAH(G)Z52F120B· high frequency IGBT, low switching los...
MSAGZ52F120A: Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof· Hermetically sealed, surface mount power package· Low package inductance· Very low thermal resistan...
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Features: · Low Forward Voltage Drop, Low Tail Current· Avalanche and Surge Rated· High Freq. Swit...
Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof·...
Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof·...
DESCRIPTION | SYMBOL | MAX. | UNIT |
Drain-to-Source Breakdown Voltage (Gate Shorted to Source) @ TJ 25°C |
BVDSS | 1200 | Volts |
Drain-to-Gate Breakdown Voltage @ TJ 25°C, RGS= 1 M | BVDGR | 1200 | Volts |
Continuous Gate-to-Source Voltage | VGS | +/-20 | Volts |
Transient Gate-to-Source Voltage | VGSM | +/-30 | Volts |
Continuous Drain Current Tj= 25°C Tj=90°C |
IC25 IC90 |
52 33 |
Amps |
Peak Collector Current (pulse width limited by Tjmax,) Tj= 25°C Tj=90°C |
ICM(25) ICM(90) |
104 66 |
Amps |
Avalanche energy (single pulse) @ IC= 25A, VCC= 50V, L= 200mH, RG= 25W, Tj= 25°C |
EAS | 65 | mJ |
Short circuit current (SOA) , VCE1200V, TJ= 150°C, tsc10ms | IC(sc) | 260 | A |
Short circuit (reverse) current (RBSOA) , VCE 1200V, TJ= 150°C | IC(sc)RBSOA | 66 | A |
Power Dissipation | PD | 300 | Watts |
Junction Temperature Range | Tj | -55 to +150 | °C |
Storage Temperature Range | Tstg | -55 to +150 | °C |
Continuous Source Current (Body Diode, MSAHZ52F120A only) | IS | 50 | Amps |
Pulse Source Current (Body Diode, MSAHZ52F120A only) | ISM | 100 | Amps |
Thermal Resistance, Junction to Case | JC | 0.4 | °C/W |