MSAGA11F120D

Features: · Low Forward Voltage Drop, Low Tail Current· Avalanche and Surge Rated· High Freq. Switching to 20KHz· Ultra Low Leakage Current· RBSOA and SCSOA Rated· Available with Lot Acceptance Testing Spec MSAGA11F120DL, -L SuffixSpecifications SYMBOL PARAMETER VALUE UNIT VCES Colle...

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SeekIC No. : 004427545 Detail

MSAGA11F120D: Features: · Low Forward Voltage Drop, Low Tail Current· Avalanche and Surge Rated· High Freq. Switching to 20KHz· Ultra Low Leakage Current· RBSOA and SCSOA Rated· Available with Lot Acceptance Test...

floor Price/Ceiling Price

Part Number:
MSAGA11F120D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

· Low Forward Voltage Drop, Low Tail Current
· Avalanche and Surge Rated
· High Freq. Switching to 20KHz
· Ultra Low Leakage Current
· RBSOA and SCSOA Rated
· Available with Lot Acceptance Testing Spec MSAGA11F120DL, "-L" Suffix



Specifications

SYMBOL PARAMETER VALUE UNIT
VCES Collector-Emitter Voltage 1200 Volts
VCGR Collector-Gate Voltage (RGE = 20K) 1200 Volts
VEG Emitter-Collector Voltage 15 Volts
VGE Gate-Emitter Voltage ±20 Volts
IC1 Continuous Collector Current @ TC = 25 22 Amps
IC2 Continuous Collector Current @ TC = 110
11 Amps
ICM Surge Current (10s x 4ms double exponential, see figure 2) 55 Amps
ICM1 Pulsed Collector Current @ TC = 25 44 Amps
ICM2 Pulsed Collector Current @ TC = 110 22 Amps
ICsurge2 Surge Current: tp= 2 us (ton= 1.5 s; toff= 0.5 ms to 50% decay), 10 pulses, duty
cycle= 1:2,500,000 (12 pulses/minute)
400 Amps
EAS Single Pulse Avalanche Energy 10 mJ
PD Total Power Dissipation 125 Watts
TJ, TSTG Operating and Storage: Junction Temperature Range ±20



Description

The features of MSAGA11F120D:

` N-Channel enhancement mode high density IGBT die
` Passivation: Polyimide, 20 um, over Silicon Nitride, .8um
` Emitter Metallization: Al/1%Si for aluminum wire bonding, 3.2 um typical.
` Collector/Gate Metallization: Ti Ni (1 um) Ag (0.2 um) for soft solder attach




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