Features: · High voltage p-channel power mosfet with parallel fast switching, soft recovery fred; complements MSAFX24N50A· Ultrafast body diode· Rugged polysilicon gate cell structure· Increased Unclamped Inductive Switching (UIS) capability· Hermetically sealed, surface mount power package· Low p...
MSAEX8P50A: Features: · High voltage p-channel power mosfet with parallel fast switching, soft recovery fred; complements MSAFX24N50A· Ultrafast body diode· Rugged polysilicon gate cell structure· Increased Unc...
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Features: · Ultrafast rectifier in parallel with the body diode (MSAE type only)· Rugged polysilic...
Features: · Ultrafast rectifier in parallel with the body diode (MSAE type only)· Rugged polysilic...
Features: · Ultrafast rectifier in parallel with the body diode (MSAE type only)· Rugged polysilic...
DESCRIPTION | SYMBOL | MAX. | UNIT |
Drain-to-Source Breakdown Voltage (Gate Shorted to Source) @ TJ 25°C |
BVDSS | 500 | Volts |
Drain-to-Gate Breakdown Voltage @ TJ 25°C, RGS= 1 M | BVDGR | 500 | Volts |
Continuous Gate-to-Source Voltage | VGS | +/-20 | Volts |
Transient Gate-to-Source Voltage | VGSM | +/-30 | Volts |
Continuous Drain Current Tj= 25°C Tj=100°C |
ID25 ID100 |
8 5 |
Amps |
Peak Drain Current, pulse width limited by TJmax | IDM | 32 | Amps |
Peak Drain Current | IAR | 8 | Amps |
Repetitive Avalanche Energy | EAR | 30 | mJ |
Single Pulse Avalanche Energy | EAS | tbd | mJ |
Voltage Rate of Change of the Recovery Diode @ ISIDM, di/dt 100 A/s, VDD VDSS, TJ 150°C |
dv/dt | 5.0 | V/ns |
Power Dissipation | PD | 300 | Watts |
Junction Temperature Range | Tj | -55 to +150 | °C |
Storage Temperature Range | Tstg | -55 to +150 | °C |
Continuous Source Current (Body Diode) | IS | 8 | Amps |
Pulse Source Current (Body Diode) | ISM | 32 | Amps |
Thermal Resistance, Junction to Case | JC | 0.35 | °C/W |