MAAP-000077-PED000

Features: · 13 Watt Saturated Output Power Level· Eutectically Mounted to Heat Spreader· Next level integration is a Silver Epoxy-Based Process· Variable Drain Voltage (6-10V) Operation· MSAG™ ProcessSpecifications Characteristic Symbol Absolute Maximum Unit Input Power PI...

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SeekIC No. : 004408046 Detail

MAAP-000077-PED000: Features: · 13 Watt Saturated Output Power Level· Eutectically Mounted to Heat Spreader· Next level integration is a Silver Epoxy-Based Process· Variable Drain Voltage (6-10V) Operation· MSAG&#...

floor Price/Ceiling Price

Part Number:
MAAP-000077-PED000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· 13 Watt Saturated Output Power Level
· Eutectically Mounted to Heat Spreader
· Next level integration is a Silver Epoxy-Based Process
· Variable Drain Voltage (6-10V) Operation
· MSAG™ Process



Specifications

Characteristic Symbol Absolute Maximum Unit
Input Power PIN 28 dBm
Drain Supply Voltage VDD +12.0 V
Gate Supply Voltage VGG -3.0 V
Quiescent Drain Current (No RF) IDQ 6.0 A
Quiescent DC Power Dissipated (No RF) PDISS 60 W
Junction Temperature TJ 17 °C
Storage Temperature TSTG -55 to +150 °C



Description

The MAAPGM0077-PED000 is a 2-stage 13W power amplifier with on-chip bias networks eutectically mounted on a 10-mil thick Copper Molybdenum (CuMo) pedestal. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications.

MAAPGM0077-PED000 Fabricated using M/A-COM's repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™)Process, each device is 100% RF tested at the die-on-pedestal assembly level to ensure performance compliance.

MAAPGM0077-PED000 M/A-COM's MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging.




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