Features: # 70-pin,400-mil TSOP (type II ) with 0.65mm lead pitch and 23.49mm package length.# Multiplexed DRAM address inputs for reduced pin count and higher system densities.# Selectable output operation (transparent / latched / registered) using set command register cycle.# Single 3.3V +/- 0.3...
M5M4V16169DRT-10: Features: # 70-pin,400-mil TSOP (type II ) with 0.65mm lead pitch and 23.49mm package length.# Multiplexed DRAM address inputs for reduced pin count and higher system densities.# Selectable output o...
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Features: • Standard 26 pin SOJ, 26 pin TSOP• Single 5V ± 10% supply• Low stand-...
Features: • Standard 26 pin SOJ, 26 pin TSOP• Single 5V ± 10% supply• Low stand-...
Features: `Standard 40pin SOJ, 44 pin TSOP (II) Single 5V±10% supply`Low stand-by power dissipatio...
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
Vcc |
Supply Voltage |
With respect to Vss |
-0.5 ~ 4.6 |
V |
VI |
Input Voltage |
|
-0.5 ~ 4.6 |
V |
VO |
Output Voltage |
|
-0.5 ~ 4.6 |
V |
IO |
Output Current |
|
50 |
mA |
Pd |
Power Dissipation |
|
1000 |
mW |
Topr |
Operating Temperature |
|
0 ~ 70 |
°C |
Tstg |
Storage Temperature |
|
-65 ~ 150 |
°C |
The M5M4V16169DTP/RT is a 16M-bit Cached DRAM which integrates input registers, a 1,048,576-word by 16-bit dynamic memory array and a 1024- word by 16-bit static RAM array as a Cache memory (block size 8x16) onto a single monolithic circuit. The block data transfer between the DRAM and the data transfer buffers (RB1/RB2/WB1/WB2) is performed in one instruction cycle, a fundamental advantage over a conventional DRAM/SRAM cache.
The RAM is fabricated with a high performance CMOS process, and is ideal for large-capacity memory systems where high speed, low power dissipation, and low cost are essential. The use of quadruple-layer polysilicon process combined with silicide and double layer aluminum wiring technology, a single-transistor dynamic storage stacked capacitor cell, and a six-transistor static storage cache cell provide high circuit density at reduced costs.