Features: MULTI-CHIP PACKAGE 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory 1 die of 16 Mbit (1Mb x16) Pseudo SRAM SUPPLY VOLTAGEVDDF = VDDP = VDDQ = 1.7 to 1.95VVPP = 9V for fast program (12V tolerant) ELECTRONIC SIGNATURE Manufacturer Code: 20h Device Code (Top Flas...
M36L0R7040B0: Features: MULTI-CHIP PACKAGE 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory 1 die of 16 Mbit (1Mb x16) Pseudo SRAM SUPPLY VOLTAGEVDDF = VDDP = VDDQ = 1.7 to 1.95VVPP = ...
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Features: MULTI-CHIP PACKAGE 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash...
Features: ` MULTI-CHIP PACKAGE 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Fla...
Features: ` Multi-Chip Package 1 die of 128 Mbit (8Mb x16, Mux I/O Multiple Bank, Multi-level, Bu...
Symbol | Parameter | Value | Unit | |
min. | max. | |||
TA | Ambient Operating Temperature | -25 | 85 | |
TBIAS | Temperature Under Bias | -25 | 85 | |
TSTG | Storage Temperature | -65 | 125 | |
TLEAD | Lead Temperature during Soldering | (1) | ||
VIO | Input or Output Voltage | 0.2 | 3.3 | V |
VDDF, VDDQ, VDDP |
Flash Memory Supply Voltage | 0.2 | 2.5 | V |
VPPF | Flash Memory Program Voltage | -0.2 | 14 | V |
IO | Output Short Circuit Current | 100 | mA | |
tVPPH | Time for VPPF at VPPH | 100 | hours |
Note: 1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification,and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
The M36L0R7040T0 and M36L0R7040B0 com-bine two memory devices in a Multi-Chip Package:
a 128-Mbit, Multiple Bank Flash memory, the M30L0R7000T0 or M30L0R7000B0, and a 16-Mbit PseudoSRAM, the M69AR024B. Recom-mended operating conditions do not allow more than one memory to be active at the same time.
The memory M36L0R7040T0 and M36L0R7040B0 is offered in a Stacked TFBGA88 (8x10mm, 8x10 ball array, 0.8mm pitch) package.In addition to the standard version, the packages are also available in Lead-free version, in compli-ance with JEDEC Std J-STD-020B, the ST ECO-PACK 7191395 Specification, and the RoHS (Restriction of Hazardous Substances) directive.
All packages of M36L0R7040T0 and M36L0R7040B0 are compliant with Lead-free solder-ing processes.
The memory M36L0R7040T0 and M36L0R7040B0 is supplied with all the bits erased (set to '1').