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IXTM12N50A

Features: · International standard packages· Low RDS (on) HDMOSTM process· Rugged polysilicon gate cell structure· Low package inductance (< 5 nH) - easy to drive and to protect· Fast switching timesApplication· Switch-mode and resonant-mode power supplies· Motor controls· Uninterruptible Power...

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SeekIC No. : 004381682 Detail

IXTM12N50A: Features: · International standard packages· Low RDS (on) HDMOSTM process· Rugged polysilicon gate cell structure· Low package inductance (< 5 nH) - easy to drive and to protect· Fast switching t...

IXTM12N50A Data Sheet

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Part Number:
IXTM12N50A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/13

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Product Details

Description



Features:

· International standard packages
· Low RDS (on) HDMOSTM process
· Rugged polysilicon gate cell structure
· Low package inductance (< 5 nH)
    - easy to drive and to protect
· Fast switching times


Application

· Switch-mode and resonant-mode power supplies
· Motor controls
· Uninterruptible Power Supplies (UPS)
· DC choppers


Specifications

Symbol Test Conditions Maximum Ratings
VCES
VCGR		 TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGE = 1 M		 500
500
 V
V
VGES
VGEM		 Continuous
Transient		 ±20
±30
 V
ID25
IDM
 TC = 25°C
TC = 25°C, pulse width limited by TJM
 12
48

A
A
A

PD TC = 25°C 180 W
TJ
TJM
Tstg		 1.6 mm (0.063 in) from case for 10 s -55 ... +150
150
-55 ... +150		 °C
°C
°C
Md Mounting torque 1.13/10 Nm/lb.in.
Weight TO-204
TO-247
 18
6		 g
g
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s		   300 °C



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