Features: · International standard packages· Low RDS (on) HDMOSTM process· Rugged polysilicon gate cell structure· Unclamped Inductive Switching (UIS) rated· Low package inductance - easy to drive and to protect· Fast intrinsic rectifierApplication· DC-DC converters· Battery chargers· Switched-mod...
IXFK 120N25: Features: · International standard packages· Low RDS (on) HDMOSTM process· Rugged polysilicon gate cell structure· Unclamped Inductive Switching (UIS) rated· Low package inductance - easy to drive a...
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Features: · RF capable MOSFETs· Double metal process for low gate resistance· Unclamped Inductive ...
Features: • International standard packages• JEDECTO-264 AA,epoxymeet UL 94 V-0, flamm...
Features: • International standard packages• JEDECTO-264 AA,epoxymeet UL 94 V-0, flamm...
Symbol | Test Conditions |
Maximum |
Ratings |
VDSS VDGR |
TJ = 25 to 150 TJ = 25 to 150 ; RGS = 1 M |
250 250 |
V V |
VGS VGSM |
Continuous Transient |
±20 ±30 |
V V |
ID25 ID104 IDM IAR |
TC = 25°C (MOSFET chip capability) TC = 104°C (External lead capability) TC = 25°C, pulse width limited by TJM TC = 25 |
120 75 480 90 |
A A A A |
EAR | TC = 25 |
64 |
mJ |
EAS | TC = 25 |
3 |
J |
dv/dt | IS IDM, di/dt100 A/s, VDDVDSS, TJ 150 , RG = 2 |
5 |
V/ns |
PD | TC = 25 |
560 |
W |
TJ TJM Tstg |
-55 ... +150 150 -55 ... +150 |
| |
TL | 1.6 mm (0.063 in.) from case for 10 s |
300 |
|
Md |
Mounting torque TO-264 |
0.7/6 |
Nm/lb.in. |
Weight | PLUS 247 TO-264 |
6 10 |
g g |