Features: • International standard packages• JEDEC TO-264 AA, epoxy meet UL 94 V-0, flammability classification• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Unclamped Inductive Switching (UIS) rated• Low package inductance• Fast i...
IXFK105N07: Features: • International standard packages• JEDEC TO-264 AA, epoxy meet UL 94 V-0, flammability classification• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell st...
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Features: · International standard packages· Low RDS (on) HDMOSTM process· Rugged polysilicon gate...
Features: · RF capable MOSFETs· Double metal process for low gate resistance· Unclamped Inductive ...
Features: • International standard packages• JEDECTO-264 AA,epoxymeet UL 94 V-0, flamm...
Symbol | Test Conditions | Maximum | Ratings |
VDSS VDGR |
TJ = 25 to 150 TJ = 25 to 150; RGS = 1 M |
N07 70 N06 60 N07 70 N06 60 |
V V V V |
VGS VGSM |
Continuous Transient |
±20 ±30 |
V V |
ID25 ID130 IDM IAR |
TC = 25, die capability TC = 130, limited by external leads TC = 25, pulse width limited by TJM TC = 25 |
110 76 600 100 |
A A A A |
EAR EAS |
TC = 25 TC = 25 |
30 2 |
mJ J |
dv/dt | IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150, RG = 2 |
5 | V/ns |
PD | TC = 25 | 500 | W |
TJ TJM Tstg |
-55 ... +150 150 -55 ... +150 |
||
TL | 1.6 mm (0.063 in) from case for 10 s | 300 | |
Md | Mounting torque Terminal connection torque |
0.9/6 - |
Nm/lb.in. Nm/lb.in. |
Weight | 10 | g |