MOSFET 23 Amps 500V 0.2 Rds
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Features: · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mount...
Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 500 V | ||
Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 23 A | ||
Resistance Drain-Source RDS (on) : | 0.2 Ohms | Configuration : | Single | ||
Maximum Operating Temperature : | + 150 C | Mounting Style : | SMD/SMT | ||
Package / Case : | ISOPLUS 220LV | Packaging : | Tube |
Symbol | Test Conditions | Maximum | Ratings |
VDSS VDGR |
TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 MΩ |
500 500 |
V V |
VGS VGSM |
Continuous Transient |
±20 ±30 |
V V |
ID25 IDM IAR |
TC = 25°C 26N50 24N50 TC = 25°C, pulse width limited by TJM 26N50 24N50 TC = 25°C 26N50 24N50 |
23 21 92 84 26 24 |
A A A A A A |
EAR |
TC = 25°C | 30 | mJ |
dv/dt | IS IDM, di/dt 100 A/µs, VDD VDSS TJ 150°C, RG = 2 Ω |
5 | V/ns |
PD | TC = 25°C | 230 | W |
TJ TJM Tstg |
-55 ... +150 150 -55 ... +150 |
°C °C °C | |
TL | 1.6 mm (0.062 in.) from case for 10 s | 300 | °C |
VISOL |
50/60 Hz, RMS t = 1 min leads to tab |
2500 |
V~ |
Weight | 2 | g |
Technical/Catalog Information | IXFC26N50 |
Vendor | IXYS |
Category | Discrete Semiconductor Products |
Mounting Type | Through Hole |
FET Polarity | N-Channel |
Drain to Source Voltage (Vdss) | 500V |
Current - Continuous Drain (Id) @ 25° C | 23A |
Rds On (Max) @ Id, Vgs | 230 mOhm @ 13A, 10V |
Input Capacitance (Ciss) @ Vds | 4200pF @ 25V |
Power - Max | 230W |
Packaging | Tube |
Gate Charge (Qg) @ Vgs | 135nC @ 10V |
Package / Case | ISOPLUS220? |
FET Feature | Standard |
Drawing Number | * |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | IXFC26N50 IXFC26N50 |