IRLR8103V

Features: • N-Channel Application-Specific MOSFETs• Ideal for CPU Core DC-DC Converters• Low Conduction Losses• Low Switching Losses• Minimizes Parallel MOSFETs for high current applications• 100% RG TestedSpecifications Parameter Symbol IRLR8103V ...

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SeekIC No. : 004378478 Detail

IRLR8103V: Features: • N-Channel Application-Specific MOSFETs• Ideal for CPU Core DC-DC Converters• Low Conduction Losses• Low Switching Losses• Minimizes Parallel MOSFETs for hig...

floor Price/Ceiling Price

Part Number:
IRLR8103V
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

• N-Channel Application-Specific MOSFETs
• Ideal for CPU Core DC-DC Converters
• Low Conduction Losses
• Low Switching Losses
• Minimizes Parallel MOSFETs for high current applications
• 100% RG Tested



Specifications

Parameter
Symbol
IRLR8103V
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
Continuous Drain or Source Current
TC = 25°C
ID
91
A
(VGS > 10V)
TC= 90°C
63
Pulsed Drain Current
IDM
363
Pulsed Drain Current
TC = 25°C
PD
115
W
TC = 90°C
60
Junction & Storage Temperature Range
TJ , TSTG
-55 to 150
°C
Continuous Source Current (Body Diode)
IS
91
A
Pulsed Source Current
ISM
363



Description

This new device IRLR8103V  employs advanced HEXFET Power MOSFET technology to achieve an unprecedented balance of on-resistance and gate charge. The reduced conduction and switching losses make it ideal for high efficiency DC-DC converters that power the latest generation of microprocessors.

The IRLR8103V has been optimized for all parameters that are critical in synchronous buck converters including RDS(on), gate charge and Cdv/dt-induced turn-on immunity. The IRLR8103V offers an extremely low combination of Qsw & RDS(on) for reduced losses in both control and synchronous FET applications.

The package of IRLR8103V  is designed for vapor phase, infra-red, convection, or wave soldering techniques. Power dissipation of greater than 2W is possible in a typical PCB mount application.




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