IRLR2908

Features: Advanced Process TechnologyUltra Low On-ResistanceDynamic dv/dt Rating 175 Operating Temperaturel Fast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ID @ TC = 25 Continuous Drain Current, VGS @ 10V (Silicon Limited) 39 A ID...

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SeekIC No. : 004378462 Detail

IRLR2908: Features: Advanced Process TechnologyUltra Low On-ResistanceDynamic dv/dt Rating 175 Operating Temperaturel Fast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter M...

floor Price/Ceiling Price

Part Number:
IRLR2908
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175 Operating Temperature
l Fast Switching
Repetitive Avalanche Allowed up to Tjmax



Specifications

  Parameter
Max.
Units
ID @ TC = 25 Continuous Drain Current, VGS @ 10V (Silicon Limited)
39
A
ID @ TC = 100 Continuous Drain Current, VGS @ 10V (See Fig. 9)
28
ID @ TC = 25 Continuous Drain Current, VGS @ 10V (Package Limited)
30
IDM Pulsed Drain Current
150
PD @TC = 25 Gate-to-Emitter Voltage
120
W
   
0.77
W/
VGS Gate-to-Source Voltage
± 16
V
EAS Single Pulse Avalanche Energy (Thermally Limited)
180
mJ
EAS (tested) Single Pulse Avalanche Energy Tested Value
250
IAR Avalanche Current
See Fig.12a,12b,15,16
A
EAR Repetitive Avalanche Energy
mJ
dv/dt Peak Diode Recovery dv/dt
2.3
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
  Soldering Temperature, for 10 seconds
300 (1.6mm from case )



Description

Specifically designed for Automotive applications, this HEXFET ® Power MOSFET IRLR2908 utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this HEXFET power MOSFET are a 175 junction operating temperature, low RJC, fast switching speed and improved repetitive avalanche rating.

These features of IRLR2908 combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.\

The D-Pak IRLR2908 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.

The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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