Features: Advanced Process TechnologyUltra Low On-ResistanceDynamic dv/dt Rating 175 Operating Temperaturel Fast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ID @ TC = 25 Continuous Drain Current, VGS @ 10V (Silicon Limited) 39 A ID...
IRLR2908: Features: Advanced Process TechnologyUltra Low On-ResistanceDynamic dv/dt Rating 175 Operating Temperaturel Fast SwitchingRepetitive Avalanche Allowed up to TjmaxSpecifications Parameter M...
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Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology `Lower Input Capacitance`Impro...
Features: ·Logic Level Gate Drive·Ultra Low On-Resistance·Surface Mount (IRLR3410)·Straight Lead (...
Parameter |
Max. |
Units | |
ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Silicon Limited) |
39 |
A |
ID @ TC = 100 | Continuous Drain Current, VGS @ 10V (See Fig. 9) |
28 | |
ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Package Limited) |
30 | |
IDM | Pulsed Drain Current |
150 | |
PD @TC = 25 | Gate-to-Emitter Voltage |
120 |
W |
0.77 |
W/ | ||
VGS | Gate-to-Source Voltage |
± 16 |
V |
EAS | Single Pulse Avalanche Energy (Thermally Limited) |
180 |
mJ |
EAS (tested) | Single Pulse Avalanche Energy Tested Value |
250 | |
IAR | Avalanche Current |
See Fig.12a,12b,15,16 |
A |
EAR | Repetitive Avalanche Energy |
mJ | |
dv/dt | Peak Diode Recovery dv/dt |
2.3 |
V/ns |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
|
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
Specifically designed for Automotive applications, this HEXFET ® Power MOSFET IRLR2908 utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this HEXFET power MOSFET are a 175 junction operating temperature, low RJC, fast switching speed and improved repetitive avalanche rating.
These features of IRLR2908 combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.\
The D-Pak IRLR2908 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.