FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Mounting Type: Surface Mount
Vgs(th) (Max) @ Id: 2V @ 250µA
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Supplier Device Package: D-Pak
Series: HEXFET®
Packaging: Tube
Current - Continuous Drain (Id) @ 25° C: 28A
Drain to Source Voltage (Vdss): 55V
Manufacturer: International Rectifier
Rds On (Max) @ Id, Vgs: 40 mOhm @ 17A, 10V
Gate Charge (Qg) @ Vgs: 25nC @ 5V
Input Capacitance (Ciss) @ Vds: 880pF @ 25V
Power - Max: 68W
Features: · Logic-Level Gate Drive
· Ultra Low On-Resistance
· Surface Mount (IRLR2705)
· Straight Lead (IRLU2705)
· Advanced Process Technology
· Fast Switching
· Fully Avalanche Rated
Specifications
| |
Parameter |
Max. |
Units |
| ID @ TC = 25°C |
Continuous Drain Current, VGS @ 10V |
28 |
A |
| ID @ TC = 100°C |
Continuous Drain Current, VGS @ 10V |
20 |
| IDM |
Pulsed Drain Current |
110 |
| PD @TC = 25°C |
Power Dissipation |
68 |
W |
| |
Linear Derating Factor |
0.45 |
W/°C |
| VGS |
Gate-to-Source Voltage |
± 16 |
V |
| EAS |
Single Pulse Avalanche Energy |
110 |
mJ |
| IAR |
Avalanche Current |
16 |
A |
| EAR |
Repetitive Avalanche Energy |
6.8 |
mJ |
| dv/dt |
Peak Diode Recovery dv/dt |
5.0 |
V/ns |
TJ
TSTG |
Operating Junction and
Storage Temperature Range |
-55 to + 175 |
°C |
| |
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
DescriptionFifth Generation HEXFETs from International Rectifier IRLR2705 utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLR2705 design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
The D-PAK IRLR2705 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.
IRLR2705 Data Sheet
