IRLI530N

FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Current - Continuous Drain (Id) @ 25° C: 12A
Drain to Source Voltage (Vdss): 100V
Vgs(th) (Max) @ Id: 2V @ 250µA
Series: HEXFET®
Packaging: Tube
Mounting Type: Through Hole
Input Capacitance (Ciss) @ Vds: 800pF @ 25V
Rds On (Max) @ Id, Vgs: 100 mOhm @ 9A, 10V
Package / Case: TO-220-3 Full Pack
Manufacturer: International Rectifier
Gate Charge (Qg) @ Vgs: 34nC @ 5V
Power - Max: 41W
Supplier Device Package: TO-220AB Full-Pak


Specifications

	Parameter	Max.	Units
ID @ TC = 25°C	Continuous Drain Current, VGS @ 10V	12	A
ID @ TC = 100°C	Continuous Drain Current, VGS @ 10V	8.6
IDM	Pulsed Drain Current	60
PD @TC = 25°C	C Power Dissipation	4.1	W
	Linear Derating Factor	0.27	W/°C
VGS	Gate-to-Source Voltage	±16	V
EAS	Single Pulse Avalanche Energy	150	mJ
IAR	Avalanche Current	9.0	A
EAR	Repetitive Avalanche Energy	4.1	mJ
dv/dt	Peak Diode Recovery dv/dt	5.0	V/ns
TJ TSTG	Operating Junction and Storage Temperature Range	-55 to + 175	°C
	Soldering Temperature, for 10 seconds	300 (1.6mm from case )
	Mounting torque, 6-32 or M3 screw.	10 lbf•in (1.1N•m)

Description

Fifth Generation HEXFETs from International Rectifier IRLI530N utilize advanced processing techniques to achieveextremely low on-resistance per silicon area. This benefit, com bined with the fast switching speed and ruggedized device IRLI530N design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.