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IRLI3615

Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating·175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 14 A ID @ TC = 100°C ...

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IRLI3615: Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating·175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. ...

IRLI3615 Data Sheet

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Part Number:
IRLI3615
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
·175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated


Specifications
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
14
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
9.8
IDM
Pulsed Drain Current
56
PD @TC = 25°C
Power Dissipation
45
W
Linear Derating Factor
0.30
W/°C
VGS
Gate-to-Source Voltage
±16
V
EAS
Single Pulse Avalanche Energy
340
mJ
IAR
Avalanche Current
8.4
A
EAR
Repetitive Avalanche Energy
4.5
mJ
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
oC
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew
10 lbf•in (1.1N•m)



Description

Fifth Generation HEXFETs from International Rectifier IRLI3615 utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLI3615 design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.




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