IRLI3303

Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @10V 25 ID @ TC = 100°C Continuous Drain Current, VGS @10V 18 A IDM Pulsed Drain Current 140 PD @TC = 25°C Power Dissipation 31 Linear Derating Factor 0....

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SeekIC No. : 004378380 Detail

IRLI3303: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @10V 25 ID @ TC = 100°C Continuous Drain Current, VGS @10V 18 A IDM Pulsed Drai...

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Part Number:
IRLI3303
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/3/10

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Product Details

Description



Specifications

Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @10V
25
ID @ TC = 100°C Continuous Drain Current, VGS @10V
18
A
IDM Pulsed Drain Current
140
PD @TC = 25°C Power Dissipation
31
Linear Derating Factor
0.21
W/°C
VGS Gate-to-Source Voltage
± 20
V
EAS Single Pulse Avalanche Energy
130
mJ
IAR Avalanche Current
20
A
EAR Repetitive Avalanche Energy
5.6
mJ
dv/dt Peak Diode Recovery dv/dt
2.6
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
°C
Soldering Temperature, for 10 seconds
300 (1.6mm from case)
   Mounting torque, 6-32 or M3 screw.  10 lbf•in (1.1N•m)  



Description

Fifth Generation HEXFETs from International Rectifier IRLI3303 utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLI3303 design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing




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