IRLI2910

FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Drain to Source Voltage (Vdss): 100V
Vgs(th) (Max) @ Id: 2V @ 250µA
Series: HEXFET®
Packaging: Tube
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack
Current - Continuous Drain (Id) @ 25° C: 31A
Manufacturer: International Rectifier
Power - Max: 63W
Supplier Device Package: TO-220AB Full-Pak
Gate Charge (Qg) @ Vgs: 140nC @ 5V
Input Capacitance (Ciss) @ Vds: 3700pF @ 25V
Rds On (Max) @ Id, Vgs: 26 mOhm @ 16A, 10V


Specifications

	Parameter	Max.	Units
ID @ TC = 25°C	Continuous Drain Current, VGS @ 10V	31	A
ID @ TC = 100°C	Continuous Drain Current, VGS @ 10V	22
IDM	Pulsed Drain Current	190
PD @TC = 25°C	C Power Dissipation	63	W
	Linear Derating Factor	0.42	W/°C
VGS	Gate-to-Source Voltage	±16	V
EAS	Single Pulse Avalanche Energy	520	mJ
IAR	Avalanche Current	29	A
EAR	Repetitive Avalanche Energy	6.3	mJ
dv/dt	Peak Diode Recovery dv/dt	5.0	V/ns
TJ TSTG	Operating Junction and Storage Temperature Range	-55 to + 175	°C
	Soldering Temperature, for 10 seconds	300 (1.6mm from case )
	Mounting torque, 6-32 or M3 screw.	10 lbf•in (1.1N•m)

Description

Fifth Generation HEXFETs from International Rectifier IRLI2910 utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLI2910 design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications.

The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.