Features: ·Single Event Effect (SEE) Hardened· Ultra Low RDS(on)· Neutron Tolerant· Identical Pre- and Post-Electrical Test Conditions· Repetitive Avalanche Ratings·Dynamic dv/dt Ratings· Simple Drive Requirements· Ease of Paralleling· Hermetically SealedSpecifications Parameter Max. ...
IRHF57230: Features: ·Single Event Effect (SEE) Hardened· Ultra Low RDS(on)· Neutron Tolerant· Identical Pre- and Post-Electrical Test Conditions· Repetitive Avalanche Ratings·Dynamic dv/dt Ratings· Simple Dri...
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Features: · Single Event Effect (SEE) Hardened· Ultra Low RDS(on)· Neutron Tolerant· Identical Pre...
Parameter |
Max. |
Units | |
ID @ VGS = 12V, TC = 25°C | Continuous Drain Current |
7.3 |
A |
ID @ VGS = 12V, TC = 100°C | Continuous Drain Current |
4.5 | |
IDM | Pulsed Drain Current |
29 | |
PD @TA = 25°C | Max. Power Dissipation |
25 |
W |
Linear Derating Factor |
0.2 |
W/°C | |
VGS | Gate-to-Source Voltage |
± 20 |
V |
EAS | Single Pulse Avalanche Energy |
110 |
mJ |
IAR | Avalanche Current |
7.3 |
A |
EAR | Repetitive Avalanche Energy |
2.5 |
mJ |
dv/dt | Peak Diode Recovery dv/dt |
7.0 |
V/ns |
TJ |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
°C |
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) | ||
Weight |
0.98 (Typical) |
g |