Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· 175 Operating Temperature· Lower Leakage Current : 10 A (Max.) @ VDS = 100V· Lower RDS(ON) : 0.092 (Typ.)Specifications Symbol Characteristic V...
IRFWI530A: Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· 175 Operating Temperature· Lower Leakage Current :...
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Features: Avalanche Rugged TechnologyRugged Gate Oxide TechnologyLower Input CapacitanceImproved G...
Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improv...
Symbol | Characteristic | Value | Units |
VDSS | Drain-to-Source Voltage | 100 | V |
ID | Continuous Drain Current (TC=25 ) | 14 | A |
Continuous Drain Current (TC=100 ) | 9.9 | ||
IDM | Drain Current-Pulsed | 56 | A |
VGS | Gate-to-Source Voltage | ±.0 | V |
EAS | Single Pulsed Avalanche Energy | 261 | mJ |
IAR | Avalanche Current | 14 | A |
EAR | Repetitive Avalanche Energy | 5.5 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 6.5 | V/ns |
PD | Total Power Dissipation (TA=25 ) | 3.8 | W |
Total Power Dissipation (TC=25 ) Linear Derating Factor |
55 0.36 |
W/°C | |
TJ , TSTG | Operating Junction and Storage Temperature Range |
- 55 to +175 | °C |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |