MOSFET N-Chan 500V 11 Amp
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Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 500 V | ||
Gate-Source Breakdown Voltage : | +/- 30 V | Continuous Drain Current : | 11 A | ||
Resistance Drain-Source RDS (on) : | 0.55 Ohms | Configuration : | Single | ||
Maximum Operating Temperature : | + 175 C | Mounting Style : | Through Hole | ||
Package / Case : | TO-262 | Packaging : | Tube |
Parameter |
Max. |
Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V |
11 |
A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V |
7.8 | |
IDM | Pulsed Drain Current |
44 | |
PD @TC = 25°C | Power Dissipation |
190 |
W
|
Linear Derating Factor |
1.3 |
W/°C | |
VGS | Gate-to-Source Voltage |
±30 |
V |
EAS | Single Pulse Avalanche Energy |
390 |
mJ |
IAR | Avalanche Current |
11 |
A |
EAR | Repetitive Avalanche Energy |
19 |
mJ |
dv/dt | Peak Diode Recovery dv/dt |
4.1 |
V/ns |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55to+175 |
|
Soldering Temperature, for 10 seconds |
300(1.6mm from case ) |
Parameter |
Typ. |
Max. |
Units | |
RJC | Junction-to-Case |
- |
0.75 |
°C/W |
RJA | Junction-to-Ambient |
- |
40 |
Third Generation HEXFET® Power MOSFETs of the IRFSL11N50A from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.