Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 mA (Max.) @ VDS = 500V·Lower RDS(ON) : 0.638 W (Typ.)Specifications Symbol Parameter Value Units VDSS Drain...
IRFS840A: Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 mA (Max.) @ VDS = 500V·Lower ...
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Symbol |
Parameter |
Value |
Units |
VDSS |
Drain-to-Source Voltage |
500 |
V |
ID |
Continuous Drain Current (TC=25 ) Continuous Drain Current (TC=100 ) |
4.6 2.9 |
A |
IDM |
Drain Current-Pulsed Gate-to-Source Voltage |
32 |
W/ |
VGS |
Gate-to-Source Voltage |
±30 |
V |
EAS |
Single Pulse Avalanche Energy |
647 |
mJ |
IAR |
Avalanche Current |
4.6 |
A |
EAR |
Repetitive Avalanche Energy |
4.4 |
mJ |
dV/dt |
Peak Diode Recovery dv/dt |
3.5 |
V/ns |
PD |
Total Power Dissipation (TC=25 ) Linear Derating Factor |
44 0.35 |
W |
TJ |
Operating Junction |
-55 to 200 |
|
TSTG |
Storage Temperature Range | ||
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8 " from case for 5-seconds |
300 |