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IRFIZ34VPbF

Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating·175°C Operating Temperature· Fast Switching· Fully Avalanche Rated· Optimized for SMPS Applications· Lead-FreeSpecifications Parameter Max. Units ID @ TC = 25 Continuous Drain Current, VGS @...

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SeekIC No. : 004377160 Detail

IRFIZ34VPbF: Features: · Advanced Process Technology· Ultra Low On-Resistance· Dynamic dv/dt Rating·175°C Operating Temperature· Fast Switching· Fully Avalanche Rated· Optimized for SMPS Applications· Lead-FreeS...

IRFIZ34VPbF Data Sheet

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Part Number:
IRFIZ34VPbF
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
·175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated
· Optimized for SMPS Applications
· Lead-Free


Specifications

 
Parameter
Max.
Units
ID @ TC = 25
 Continuous Drain Current, VGS @ 10V
20
A
ID @ TC = 100
 Continuous Drain Current, VGS @ 10V
14
IDM
 Pulsed Drain Current
120
PD @TC = 25
 Power Dissipation
30
W
 Linear Derating Factor
0.20
W/
VGS
 Gate-to-Source Voltage
± 20
V
VGS
 Single Pulse Avalanche Energy
81
mJ
IAR
 Avalanche Current
30
A
EAR
 Repetitive Avalanche Energy
3.0
mJ
dv/dt
 Peak Diode Recovery dv/dt
4.5
V/ns
TJ
TSTG
 Operating Junction and
Storage Temperature Range
-55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
 Mounting Torque, 6-32 or M3 screw
10 lbf`in (1.1N`m)



Description

Advanced HEXFET® Power MOSFETs IRFIZ34VPbF from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.

This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.


The TO-220 Fullpak IRFIZ34VPbF eliminates the need for additional insulating hardware in commercial-industrial applications.


The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation IRFIZ34VPbF is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.




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