Gate-Source Breakdown Voltage
: +/- 20 V
Configuration
: Single
Maximum Operating Temperature
: + 175 C
Mounting Style
: Through Hole
Transistor Polarity
: P-Channel
Packaging
: Tube
Drain-Source Breakdown Voltage
: - 60 V
Resistance Drain-Source RDS (on)
: 0.28 Ohms
Package / Case
: TO-220 Full-Pak
Continuous Drain Current
: 8.5 A
Features: • Isolated Package
• High Voltage Isolation = 2.5 kVRMS (t = 60 s;f = 60 Hz)
• Sink to Lead Creepage Distance = 4.8 mm
• P-Channel
• 175 °C Operating Temperature
• Dynamic dV/dt Rating
• Low Thermal Resistance
• Lead (Pb)-free AvailableSpecifications
| PARAMETER |
SYMBOL |
LIMIT |
UNIT |
| Drain-Source Voltage |
VDS |
-60 |
V |
| Gate-Source Voltage |
VGS |
±20 |
| Continuous Drain Current |
VGS at -10 V |
TC = 25 |
ID |
-8.5 |
A |
| TC = 100 |
-6.0 |
| Pulsed Drain Currenta |
IDM |
-34 |
| Linear Derating Factor |
|
0.24 |
W/ |
| Single Pulse Avalanche Energyb |
EAS |
200 |
mJ |
| Repetitive Avalanche Currenta |
IAR |
-8.5 |
A |
| Repetitive Avalanche Energya |
EAR |
3.7 |
mJ |
| Maximum Power Dissipation |
TC = 25 |
PD |
37 |
W |
| Peak Diode Recovery dV/dtc |
dV/dt |
-4.5 |
V/ns |
| Operating Junction and Storage Temperature Range |
TJ, Tstg |
- 55 to + 175 |
|
| Mounting Torque |
6-32 or M3 screw |
|
10
1.1 |
lbf ` in
N ` m |
| Soldering Recommendations (Peak Temperature) |
for 10 s |
|
300d |
|
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 3.2 mH, RG = 25 , IAS = - 8.5 A (see fig. 12).
c. ISD - 11 A, dI/dt 140 A/s, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may applyDescriptionThird generation Power MOSFETs IRFI9Z24G from Vishay provide the designer with the best combination of fast switching,ruggedized device design, low on-resistance and cost-effectiveness.
The TO-220 FULLPAK IRFI9Z24G eliminates the need for additional insulating hardware in commercial-industrial applications.
The molding compound IRFI9Z24G used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The FULLPAK is mounted to a heatsink using a single clip or by a single screw fixing.
IRFI9Z24G Data Sheet
