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IRFI3710

Features: · Advanced Process Technology· Isolated Package· High Voltage Isolation = 2.5KVRMS …· Sink to Lead Creepage Dist. = 4.8mm· Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 32 A ID @ TC = 100°C Continuous D...

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SeekIC No. : 004377087 Detail

IRFI3710: Features: · Advanced Process Technology· Isolated Package· High Voltage Isolation = 2.5KVRMS …· Sink to Lead Creepage Dist. = 4.8mm· Fully Avalanche RatedSpecifications Parameter Max. ...

IRFI3710 Data Sheet

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Part Number:
IRFI3710
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Advanced Process Technology
· Isolated Package
· High Voltage Isolation = 2.5KVRMS …
· Sink to Lead Creepage Dist. = 4.8mm
· Fully Avalanche Rated


Specifications

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 32 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 23
IDM Pulsed Drain Current 180
PD @TC = 25°C Power Dissipation 63 W
  Linear Derating Factor 0.42 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 530 mJ
IAR Avalanche Current 28 A
EAR Repetitive Avalanche Energy 6.3 mJ
dv/dt Repetitive Avalanche Energy 5.0 V/ns
TJ
TSTG		 Peak Diode Recovery dv/dt
Storage Temperature Range		 -55 to + 175 °C
  Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C
  Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)  



Description

Fifth Generation HEXFETs IRFI3710 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 Fullpak IRFI3710 eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.




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