Features: ·Ultra Low On-Resistance·P-Channel MOSFET·Surface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain- Source Voltage -30 V ID @ TA = 25°C Continuous Drain Current, VGS @ 10V -8.0 A ID @ TA = 100°C Continuous Drain Curren...
IRF4435: Features: ·Ultra Low On-Resistance·P-Channel MOSFET·Surface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain- Source Voltage -30 V ID @ TA =...
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Parameter |
Max. |
Units | |
VDS | Drain- Source Voltage |
-30 |
V |
ID @ TA = 25°C | Continuous Drain Current, VGS @ 10V |
-8.0 |
A |
ID @ TA = 100°C | Continuous Drain Current, VGS @ 10V |
-6.4 | |
IDM | Pulsed Drain Current |
-50 | |
PD @TA = 25°C | Power Dissipation |
25 |
W |
PD @TA = 70°C | Power Dissipation |
1.6 | |
Linear Derating Factor |
0.02 |
W/°C | |
VGS | Gate-to-Source Voltage |
± 20 |
V |
TJ,TSTG | Junction and Storage Temperature Range |
-55 to + 150 |
°C |
These P-channel HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer of IRF4435 with an extremely efficient device for use in battery and load management applications..
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making IRF4435 ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.