IR0530CSP

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest V_F to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections of the IR0530CSP are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency.

Typical applications of the IR0530CSP include hand-held, portable equipment such as cell phones, MP3 players, PDAs, and portable hard disk drives where space savings and performance are crucial.