INA-51063

Features: • Ultra-Miniature Package• Internally Biased, Single 5 V Supply (12 mA)• 20.5 dB Gain• 3 dB NF• Unconditionally StableApplication• Amplifier for Cellular, Cordless, Special Mobile Radio, PCS, ISM, Wireless LAN, DBS, TVRO, and TV Tuner ApplicationsSpeci...

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SeekIC No. : 004375452 Detail

INA-51063: Features: • Ultra-Miniature Package• Internally Biased, Single 5 V Supply (12 mA)• 20.5 dB Gain• 3 dB NF• Unconditionally StableApplication• Amplifier for Cellula...

floor Price/Ceiling Price

Part Number:
INA-51063
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/30

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Product Details

Description



Features:

• Ultra-Miniature Package
• Internally Biased, Single 5 V Supply (12 mA)
• 20.5 dB Gain
• 3 dB NF
• Unconditionally Stable



Application

• Amplifier for Cellular,
  Cordless, Special Mobile
  Radio, PCS, ISM, Wireless
  LAN, DBS, TVRO, and TV
  Tuner Applications



Specifications

Symbol

Parameter

Units Absolute
Maximum[1]
VCC Supply Voltage, to ground V 12
Pin CW RF Input Power dBm +13
Tj Junction Temperature °C 150
TSTG Storage Temperature °C -65 to 150
Thermal Resistance[2]:
j-c = 200°C/W

Notes:
1. Operation of this device above any one of these limits may cause permanent damage.
2. TC = 25°C (TC is defined to be the temperature at the package pins where contact is made to the circuit board).




Description

Hewlett-Packard's INA-51063 is a Silicon monolithic amplifier that offers excellent gain and noise figure for applications to 2.4 GHz. Packaged in an ultra-miniature SOT-363 package, it requires half the board space of a SOT-143 package.

The INA-51063 uses a topology which is internally biased, eliminating the need for external components and providing decreased sensitivity to ground inductance.

The INA-51063 is fabricated using HP's 30 GHz fMAX ISOSATTM Silicon bipolar process which uses nitride self-alignment submicrometer lithography, trench isolation, ion implantation, gold metallization, and polyimide intermetal dielectric and scratch protection to achieve superior performance, uniformity, and reliability.




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