ICSSSTUAF32868A

Features: • 28-bit 1:2 registered buffer with parity check functionality• Supports SSTL_18 JEDEC specification on data inputs and outputs• Supports LVCMOS switching levels on CSGEN andRESET inputs• Low voltage operation: VDD = 1.7V to 1.9V• Available in 176-ball LFBGA...

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ICSSSTUAF32868A Picture
SeekIC No. : 004371366 Detail

ICSSSTUAF32868A: Features: • 28-bit 1:2 registered buffer with parity check functionality• Supports SSTL_18 JEDEC specification on data inputs and outputs• Supports LVCMOS switching levels on CSGEN...

floor Price/Ceiling Price

Part Number:
ICSSSTUAF32868A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/30

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Product Details

Description



Features:

• 28-bit 1:2 registered buffer with parity check functionality
• Supports SSTL_18 JEDEC specification on data inputs and outputs
• Supports LVCMOS switching levels on CSGEN and RESET inputs
• Low voltage operation: VDD = 1.7V to 1.9V
• Available in 176-ball LFBGA package



Application

• DDR2 Memory Modules
• Provides complete DDR DIMM solution with ICS98ULPA877A or IDTCSPUA877A
• Ideal for DDR2 400, 533, and 667



Specifications


Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Item
Rating
Supply Voltage, VDD -0.5V to 2.5V
Input Voltage Range, VI1 -0.5V to VDD + 2.5V
Output Voltage Range, VO1,2 -0.5V to VDDQ + 0.5V
Input Clamp Current, IIK ±50mA
Output Clamp Current, IOK ±50mA
Continuous Output Clamp Current, IO ±50mA
Continuous Current through each VDD or GND ±100mA
Package Thermal Impedance (ja)3 0m/s Airflow 40.4/W
1m/s Airflow 29.1/W
Storage Temperature -65 to +150
1 The input and output negative voltage ratings may be exceeded if the ratings of the I/P and O/P clamp current are observed.
2 This current will flow only when the output is in the high state level VO > VDDQ.
3 The package thermal impedance is calculated in accordance with JESD 51.



Description

This 28-bit 1:2 configurable registered buffer of the ICSSSTUAF32868A is designed for 1.7V to 1.9V VDD operation. All inputs are compatible with the JEDEC standard for SSTL_18, except the chip-select gate-enable (CSGEN), control (C), and reset (RESET) inputs, which are LVCMOS. All outputs are edge-controlled circuits optimized for unterminated DIMM loads, and meet SSTL_18 specifications, except the open-drain error ( QERR ) output.

The ICSSSTUAF32868A operates from a differential clock (CLK and CLK). Data are registered at the crossing of CLK going high and CLK going low. The device supports low-power standby operation. When RESET is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (Vref) inputs are allowed. In addition, when RESET is low, all registers are reset and all outputs are forced low except QERR . The LVCMOS RESET and C inputs must always be held at a valid logic high or low level. To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up. In the DDR2 RDIMM application, RESET of the ICSSSTUAF32868A is specified to be completely asynchronous with respect to CLK and CLK. Therefore, no timing relationship can be ensured between the two. When entering reset, the register will be cleared and the data outputs will be driven low quickly, relative to the time to disable the differential input receivers. However, when coming out of reset, the register will become active quickly, relative to the time to enable the differential input receivers. As long as the data inputs are low, and the clock is stable during the time from the low-to-high transition of RESET until the input receivers are fully enabled, the design of the ICSSSTUAF32868A must ensure that the outputs will remain low, thus ensuring no glitches on the output.

The ICSSSTUAF32868A includes a parity checking function. Parity, which arrives one cycle after the data input to which it applies, is checked on the PAR_IN input of the device. The corresponding  QERR  output signal for the data inputs is generated two clock cycles after the data, to which the  QERR  signal applies, is registered. The ICSSSTUAF32868A accepts a parity bit from the memory controller on the parity bit (PAR_IN) input, compares it with the data received on the DIMM-independent D-inputs (D1-D5, D7, D9-D12, D17-D28 when C = 0; or D1-D12, D17-D20, D22, D24-D28 when C = 1) and indicates whether a parity error has occurred on the open-drain  QERR  pin (active low). The convention is even parity, i.e., valid parity is defined as an even number of ones across the DIMM-independent data inputs combined with the parity input bit. To calculate parity, all DIMM-independent D-inputs must be tied to a known logic state. If an error occurs and the  QERR  output is driven low, it stays latched low for a minimum of two clock cycles or until RESET is driven low. If two or more consecutive parity errors occur, the  QERR  output is driven low and latched low for a clock duration equal to the parity error duration or until RESET is driven low. If a parity error occurs on the clock cycle before the device enters the low-power (LPM) and the  QERR output of the ICSSSTUAF32868A is driven low, then it stays lateched low for the LPM duration plus two clock cycles or until RESET is driven low.

The DIMM-dependent signals (DCKE0, DCKE1, DODT0, DODT1, DCS0 and DCS1) of the ICSSSTUAF32868A are not included in the parity check computation. The C input controls the pinout configuration from register-A configuration (when low) to register-B configuration (when high). The C input should not be switched during normal operation. It should be hardwired to a valid low or high level to configure the register in the desired mode. The device also supports low-power active operation by monitoring both system chip select ( DCS0 and DCS1) and CSGEN inputs and will gate the Qn outputs from changing states when CSGEN, DCS0, and DCS1 inputs are high. If CSGEN, DCS0 orDCS1 input is low, the Qn outputs will function normally. Also, if both DCS0 and DCS1 inputs are high, the device will gate the  QERR  output from changing states. If either DCS0 orDCS1 is low, the  QERR  output will function normally. The RESET input has priority over the  DCS0 and DCS1 control and when driven low will force the Qn outputs low, and the  QERR  output high. If the chip-select control functionality of the ICSSSTUAF32868A is not desired, then the CSGEN input can be hard-wired to ground, in which case, the setup-time requirement for DCS0 and DCS1 would be the same as for the other D data inputs. To control the low-power mode with DCS0 and DCS1 only, then the CSGEN input should be pulled up to Vdd through a pullup resistor. The two VREF pins (A1 and V1) are connected together internally by approximately 150. However, it is necessary to connect only one of the two VREF pins to the external VREF power supply. An unused VREF pin should be terminated with a VREF coupling capacitor.




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