Features: • 64 MByte and 128 MByte non-ECC versions• High speed 800 & 600 MHz RDRAM storage• 184 edge connector pads with 1 mm pad spacing• Maximum module PCB size: 133.5 mm * 31.75 mm * 1.37 mm (5.25 * 1.25 * 0.05 )• Each RDRAM has 32 banks, for a total of 128 ...
HYR163249G: Features: • 64 MByte and 128 MByte non-ECC versions• High speed 800 & 600 MHz RDRAM storage• 184 edge connector pads with 1 mm pad spacing• Maximum module PCB size: 133.5...
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Features: • High speed 800, 711 & 600 MHz RDRAM storage• 184 edge connector pads w...
Features: • High speed 800, 711 & 600 MHz RDRAM storage• 184 edge connector pads w...
Symbol |
Parameter |
Limit Values |
Unit | |
min. |
max. | |||
V I,ABS | Voltage applied to any RSL or CMOS signal pad with respect to GND |
0.3 |
VDD + 0.3 |
V |
V DD,ABS | Voltage on VDD with respect to GND |
-0.5 |
VDD + 1.0 |
V |
TSTORE | Storage temperature |
50 |
100 |
The Direct Rambus™ RIMM™ HYR163249G module is a general purpose high-performance memory subsystem suitable for use in a broad range of applications including computer memory, personal computers, workstations, and other applications where high bandwidth and low latency are required. The Direct Rambus RIMM module consists of 288 Mbit Direct Rambus DRAM (Direct RDRAM™) devices.
These are extremely high-speed CMOS DRAMs of the HYR163249G organized as 16M words by 18 bits. The use of Rambus Signaling Level (RSL) technology permits 600 MHz to 800 MHz transfer rates while using conventional system and board design technologies.
Direct RDRAM devices of the HYR163249G are capable of sustained data transfers at 1.25 ns per two bytes (10 ns per sixteen bytes). The RDRAM architecture enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed, memory transactions. The separate control and data buses with independent row and column control yield over 95% bus efficiency. The RDRAM's 32-bank architecture supports up to four simultaneous transactions per device.