HMC-MDB171

Features: Wide IF Bandwidth: DC - 5 GHzHigh Image Rejection: 25 dBHigh LO to RF IsolationPassive: No DC Bias RequiredDie Size: 1.5 x 2.0 x 0.1 mmApplicationThis HMC-MDB171 is ideal for:• Point-to-Point Radios• Military Radar, ECM & EW• Test & Measurement Equipment• ...

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SeekIC No. : 004364590 Detail

HMC-MDB171: Features: Wide IF Bandwidth: DC - 5 GHzHigh Image Rejection: 25 dBHigh LO to RF IsolationPassive: No DC Bias RequiredDie Size: 1.5 x 2.0 x 0.1 mmApplicationThis HMC-MDB171 is ideal for:• Point...

floor Price/Ceiling Price

Part Number:
HMC-MDB171
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Wide IF Bandwidth: DC - 5 GHz
High Image Rejection: 25 dB
High LO to RF Isolation
Passive: No DC Bias Required
Die Size: 1.5 x 2.0 x 0.1 mm



Application

This HMC-MDB171 is ideal for:
• Point-to-Point Radios
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM
• Sensors



Specifications

Maximum Channe Temperature
180
Storage Temperature
-65 to 150
Operating Temperature
-55 to 85



Description

The HMC-MDB171 is a monolithic I/Q Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC mixer is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB171 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.




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