Features: ·Noise Figure: 3.8 dB·P1dB: +12 dBm·Gain: 21 dB·Supply Voltage: +2.5V·50 Ohm Matched Input/Output·Die Size: 1.55 x 0.73 x 0.1 mmApplicationThis HMC-ALH382 is ideal for:• Short Haul / High Capacity Links• Wireless LANs• Military & SpaceSpecifications Drain Bias ...
HMC-ALH382: Features: ·Noise Figure: 3.8 dB·P1dB: +12 dBm·Gain: 21 dB·Supply Voltage: +2.5V·50 Ohm Matched Input/Output·Die Size: 1.55 x 0.73 x 0.1 mmApplicationThis HMC-ALH382 is ideal for:• Short Haul /...
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Features: ·Output IP3: +25 dBm·P1dB: +16 dBm·Gain: 13 dB·Supply Voltage: +5 V·50 Ohm Matched Input...
Features: Output IP3: +25 dBmP1dB: +17 dBmGain: 24 dBSupply Voltage: +5 V50 Ohm Matched Input/Outp...
Features: Noise Figure: 2.5 dBGain: 11.6 dB @ 10 GHzP1dB Output Power: +10 dBmSupply Voltage: +2V ...
Drain Bias Voltage | +5.5 Vdc |
Gate Bias Voltage | -1 to +0.3 Vdc |
RF Input Power | -5 dBm |
Storage Temperature | -65 to +150 |
Operating Temperature | -55 to +85 |
The HMC-ALH382 is a high dynamic range, four stage GaAs HEMT MMIC Low Noise Amplifier (LNA) which operates between 57 and 65 GHz. The HMC-ALH382 features 21 dB of small signal gain, 4 dB of noise figure and an output power of +12 dBm at 1dB compression from a +2.5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.
This HMC-ALH382 versatile LNA is compatible with conventional die attach methods, as well as thermocompression thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
The HMC-ALH382 is a high dynamic range, four stage GaAs HEMT MMIC Low Noise Amplifi er (LNA) which operates between 57 and 65 GHz. The HMC-ALH382 features 21 dB of small signal gain,4 dB of noise fi gure and an output power of +12 dBm at 1dB compression from a +2.5V supplyvoltage. All bond pads and the die backside are Ti/Au metallized and the amplifi er device is fully passivated for reliable operation. This versatile LNA is compatible with conventional die attach methods, as well as thermocompression and thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment andcontacted with RF probes.