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HB52RF1289E2-75B

Features: • Fully compatible with : JEDEC standard outline 8-byte DIMM• 168-pin socket type package (dual lead out) Outline: 133.37 mm (length) × 38.10 mm (Height) × 4.80 mm (Thickness) Lead pitch: 1.27 mm• 3.3 V power supply• Clock frequency: 133 MHz (max)&...

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SeekIC No. : 004358848 Detail

HB52RF1289E2-75B: Features: • Fully compatible with : JEDEC standard outline 8-byte DIMM• 168-pin socket type package (dual lead out) Outline: 133.37 mm (length) × 38.10 mm (Height) × 4.80 mm (Thi...

HB52RF1289E2-75B Data Sheet

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Part Number:
HB52RF1289E2-75B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Fully compatible with : JEDEC standard outline 8-byte DIMM
• 168-pin socket type package (dual lead out)
 Outline: 133.37 mm (length) × 38.10 mm (Height) × 4.80 mm (Thickness)
 Lead pitch: 1.27 mm
• 3.3 V power supply
• Clock frequency: 133 MHz (max)
• LVTTL interface
• Data bus width: × 72ECC
• Single pulsed RAS
• 4 Banks can operates simultaneously and independently
• Burst read/write operation and burst read/single write operation capability
• Programmable burst length: 1/2/4/8
• 2 variations of burst sequence
 Sequential
 Interleave
• Programmable CE latency : 4
• Byte control by DQMB
• Refresh cycles: 8192 refresh cycles/64 ms
• 2 variations of refresh
 Auto refresh
 Self refresh


Specifications

Parameter
Symbol
Value
Unit
Note
Voltage on any pin relative to VSS
VT
0.5 to VCC + 0.5 ( 4.6 (max))
V
1
Supply voltage relative to VSS
VCC
0.5 to +4.6
V
1
Short circuit output current
Iout
50
mA
Power dissipation
PT
18.0
W
Operating temperature
Topr
0 to +55
°C
Storage temperature
Tstg
50 to +100
°C
Note: 1. Respect to VSS


Description

The HB52RF1289E2 belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 8-byte processor applications. The HB52RF1289E2 is a 64M × 72 × 2-bank Synchronous Dynamic RAM Module, mounted 36 pieces of 256-Mbit SDRAM (HM5225405BTB) sealed in TCP package, 1 piece of PLL clock driver, 3 pieces register driver and 1 piece of serial EEPROM (2-kbit) for Presence Detect (PD). An outline of the HB52RF1289E2 is 168-pin socket type package (dual lead out). Therefore, the HB52RF1289E2 makes high density mounting possible without surface mount technology. The product  provides common data inputs and outputs. Decoupling capacitors are mounted beside TCP on the module board.

Note of HB52RF1289E2: Do not push the cover or drop the modules in order to protect from mechanical defects, which would be electrical defects.




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