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HB526C164EN

Features: · 168-pin socket type package (dual lead out)-Outline: 133.35 mm (Length) × 25.40 mm (Height) × 2.92 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 100 MHz / 83 MHz· JEDEC standard outline unbuffered 8-byte DIMM· LVTTL interface· Data bus width: ×64 (Non parity) ...

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SeekIC No. : 004358825 Detail

HB526C164EN: Features: · 168-pin socket type package (dual lead out)-Outline: 133.35 mm (Length) × 25.40 mm (Height) × 2.92 mm (Thickness)-Lead pitch: 1.27 mm· 3.3V power supply· Clock frequency: 100 MHz / 83 MH...

HB526C164EN Data Sheet

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Part Number:
HB526C164EN
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

·  168-pin socket type package (dual lead out)
- Outline: 133.35 mm (Length) × 25.40 mm (Height) × 2.92 mm (Thickness)
- Lead pitch: 1.27 mm
·  3.3V power supply
·  Clock frequency: 100 MHz / 83 MHz
·  JEDEC standard outline unbuffered 8-byte DIMM
·  LVTTL interface
·  Data bus width: ×64 (Non parity) bit
·  2 Banks can operates simultaneously and independently
·  Burst read/write operation and burst read/single write operation capability
·  Programmable burst length: 1/2/4/8/full page
·  Programmable burst sequence
- Sequential/interleave
·  Full page burst length capability
- Sequential burst
- Burst stop capability
·  Programmable CE latency: 2/3
·  Byte control by DQMB
·  4096 refresh cycles: 64 ms


Specifications

Parameter Symbol Value Unit
Voltage on any pin relative to VSS VT 0.5 to +4.6 V
Supply voltage relative to VSS VCC 0.5 to +4.6 V
Short circuit output current Iout 50 mA
Power dissipation PT 4 W
Operating temperature Topr 0 to +85
Storage temperature Tstg 55 to +125
Note: 1. VIH (max) = 5.75 V for pulse width 5 ns.


Description

The HB526C164EN belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 8-byte processor applications. The HB526C164EN is a 512k × 64 × 2-bank Synchronous Dynamic RAM Module, mounted 4 pieces of 16-Mbit SDRAM (HM5216165TT) sealed in TSOP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). An outline of the  B526C164EN is 168-pin socket type package (dual lead out). Therefore, the HB526C164EN makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the module board.




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